Die bonding is the process of attaching a
die/chip to a substrate or package. Die bonding is accomplished by using one of
the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or
Silver-Glass
In the report, Publisher says IDMs
dominates the largest Application share in 2017. The objective of report is to
define, segment, and project the market on the basis of type, application, and
region, and to describe the content about the factors influencing market dynamics,
policy, economic, technology and market entry etc.
Based
on products type, the report describes major products type share of regional
market. Products mentioned as follows:
By Type
- Fully Automatic
- Semi-Automatic
- Manual
Based
on region, the report describes major regions market by products and
application. Regions mentioned as follows:
- Asia-Pacific
- North America
- Europe
- South America
- Middle East & Africa
Based
on Application, the report describes major Application share of regional
market. Application mentioned as follows:
- IDMs
- OSAT
Leading
vendors in the market are included based on profile, business performance etc.
Vendors mentioned as follows:
- Besi
- ASM Pacific Technology(ASMPT)
- Kulicke & Soffa
- Palomar Technologies
- Shinkawa
- DIAS Automation
- Toray Engineering
- Panasonic
- FASFORD TECHNOLOGY
- West-Bond
- Hybond
Spanning over 72 pages “Global
Die Bonder Equipment Market Research 2011 - 2022” report covers Market
Overview, Industry Chain, Environmental Analysis, Market Segmentation by Type,
Market Segmentation by Application, Market Segmentation by Region, Market
Competitive, Major Vendors, Conclusion.
Please visit this link for more details: http://mrr.cm/U6s
For related reports please visit: Die Bonder Equipment Market Research Reports
Find all Industry
and Manufacturing Reports at: http://www.marketresearchreports.com/industry-manufacturing
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