Global Semiconductor Packaging Materials market to grow at a CAGR of 4.33% over the period 2014-2019, Finds New Report

Report forecast the Global Semiconductor Packaging Materials market to grow at a CAGR of 4.33 percent over the period 2014-2019.

Semiconductor packaging materials comprise metals, plastic, and ceramic components. They not only protect the IC on the semiconductor die, but also interconnect the die and the PCB. They protect the die from external mechanical impacts and corrosion, and also act as an electrically conductive interconnects with excellent signal propagation properties. Excessive heat in the circuits is dissipated through heat spreaders. Packaging components vary in dimensions and functionality.

The Global Semiconductor Packaging Materials market can be divided into seven segments based on the type of product: Organic Substrates, Bonding Wires, Leadframes, Encapsulation Resins, Ceramic Packages, Die Attach Materials, and Other Semiconductor Packaging Materials. The key consumers of these packaging materials are the Electronics Industry, the Semiconductor Industry, and the Automotive Sector.

Global Semiconductor Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, North America, and Europe; it also covers the Global Semiconductor Packaging Materials market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key Regions

• APAC
• Europe
• North America

Key Vendors

• Alent
• BASF
• Henkel
• Hitachi Chemical
• Kyocera

Other Prominent Vendors

• Beijing Doublink Solders
• Beijing Kehua New Chemical Technology
• Cheil Industries
• Diehl Metall
• Duksan Hi-metal
• DuPont
• Dynacraft
• Evergreen Semiconductor Materials
• Guangdong Rongtai
• Heesung Metal
• Heraeus
• Honeywell Electronic Materials
• Ibiden
• Indium
• IQE
• KCC
• LG Innotek
• Lintec
• Lord
• Mitsui High-Tec
• MK Electron
• Nanya PCB
• Ningbo Dongsheng IC
• Nippon Micrometal
• Nitto Denko
• Poongsan
• Samsung Techwin
• Shanghai Sinyang Semiconductor Materials
• Shin-Etsu Chemical
• Shinko
• Sumitomo Metal Mining
• Tanaka Denshi Kogyo
• Tatsuta Electronic Materials
• Xiamen Yonghong Electronics

Key Market Driver

• Surge in Sales of Smartphones and Smart Devices
• For a full, detailed list, view our report

Key Market Challenge

• High Dependency on Performance of Semiconductor Equipment Industry
• For a full, detailed list, view our report

Key Market Trend

• Popularity of Redistributed Chip Packaging
• For a full, detailed list, view our report

Key Questions Answered in this Report

• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

Spanning over 100 pages “Global Semiconductor Packaging Materials Market 2015-2019” report covers the Executive Summary, List of Abbreviations, Scope of the Report, Market Research Methodology, Introduction, Market Landscape, Market Segmentation by Type of Material, Market Segmentation by Packaging Technology, Geographical Segmentation, Key Leading Countries, Buying Criteria, Market Growth Drivers, Drivers and their Impact, Market Challenges, Impact of Drivers and Challenges, Market Trends, Trends and their Impact, Vendor Landscape, Key Vendor Analysis.

For further information on this report, please visit- http://mrr.cm/4fN

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